Pilot Line Tools

Pilot Line Fabrication Capabilities:

  1. 6-In. (150 mm) Wafer-scale Pilot Line for Research and Development (3 micron feature size (L/S))
  2. GEN II (370 mm x 470 mm) Pilot Line for Low Volume Production (3 micron feature size (L/S))

Both Pilot Lines are linked to a Manufacturing Execution System (MES) for Efficient Lot Management and Statistical Process Control (SPC), providing real time integrated information on:

  • Lot status
  • Quality
  • Operational capability

The 6” wafer-scale and GEN II Pilot Line toolsets summarized in Table 1 with their associated fab processes, are fully consistent to enable straightforward scale-up. A comprehensive characterization and metrology toolset listed in Table 2 has been acquired to provide QA/QC, failure analysis and process improvement tools.

  1. Substrate / Planarization Material Systems: Si, Glass, PEN, Stainless Steel (SS), Polyimide
  2. Temporary Bonding Adhesives: 200ºC, 350 ºC
  3. Photolithography: GEN II Scale Automated Distortion Compensation for Plastic Substrate Materials (PEN),
  4. Deposition:
    • Physical (sputter) vapor deposition (PVD): Al, Mo, ITO, Ta, IGZO
    • Plasma-enhanced chemical vapor deposition (PECVD): a-Si, n+a-Si, p +a-Si, SiN, SiO2, SiON
  5. Etch: dry and wet

TABLE 1: PILOT LINE TOOLSET

PROCESS CELL 6” WAFER CELL GEN II 370X470MM
Clean PCT Universal Plastics
Coat-Develop Rite Track Series 8600 and 8800 EVG 150 XL(s) and nTact Advantage II
Photo Exposure Canon MPA 600 Azores 5200gT and Tamarack 304
PECVD AMAT P5000 - MKII AKT 1600
5 Chamber Cluster Tool
Dry Etch a-Si Tegal 903, AMAT 8330
Dry Etch Nitride Tegal 901
Etch ITO AMAT 8330
Dry Etch Polymer Tegal 901
Plasma Strip Gasonics L3510 Etched in Time
Sputter 2-MRC 603 KDF 744 Sunic KDF 744, Sunic
Wet Etch SPS Universal Plastics
Wet Resist Strip Sage Solvent Hood Foresight Engineering
Bonding Laurrel W6XX Coaters
Western Magnum Laminators
DEK ELA Screen Printer
Sun-Tec Laminator
De-bonding Custom Built Equipment Custom Built Equipment
MES Mass Group

TABLE 2: IN-FAB METROLOGY TOOLS

FUNCTION TOOL SUPPLIER/MODEL SCALE
TFT Autoprobe Custom FDC GEN II
Automated Optical Inspection Orbotech 7095 GEN II+6 in
Optical Microscopy / Critical Dimensions Olympus Microscopes (2) GEN II
Film Stress Flexus 2350 FP GEN II
Composition (N, H in a-Si:H and a-SiNx:H) Thermoelectron FTIR 6 in+
Film Thickness (transparent films) Woollam Ellipsometer GEN II
Critical Dimensions / Profiles JEOL FESEM 6300F 6 in
Particle Count KLA Tencor 6100 6 in
Surface Profiling / Roughness Veeco SP3000W Interferometer
Park 150 AFM
6 in+
6 in
3 – Panel Probers
6 – Wafer Probers
1 – TNP Laser Repair
Custom FDC
Electroglas
Custom FDC
Gen II
6 in
Gen II
Film Thickness Profile /
Step Height
Toho FP-10
KLA/Tencor P16+
Gen II
6 in
Substrate Flatness FWB Custom FDC
Tamar Technologies WaferScan
Gen II
6 in
Resistivity-Rs 4D 4-pt Probe 6 in
UV-IR Transmission Cary UV-Vis 6 in

FEDC Technologies

Electronic Design Automation (EDA) for IC Design, Modeling and Simulation:

  • Professional suite of flexible/large area microelectronics design tools:
    • Circuit simulation
    • Design rule checking (DRC)
    • Layer verification (LVS)
    • Layout
    • AutoPlace and route with standard cell library development capability
  • State-of-the-art a-Si:H transistor models including VShift
  • Extensive suite of digital and analog circuit testing equipment
layout: 
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