Pilot Line Tools

 Pilot Line Fabrication Capabilities:

1. 6-In. (150 mm) Wafer-scale Pilot Line for Research and Development (3 micron feature size (L/S))
2. GEN II (370 mm x 470 mm) Pilot Line for Low Volume Production (3 micron feature size (L/S))

Both Pilot Lines are linked to a Manufacturing Execution System (MES) for Efficient Lot Management and Statistical Process Control (SPC), providing real time integrated information on:

• Lot status
• Quality
• Operational capability
• Facilitates yield enhancement
• Troubleshooting

The 6” wafer-scale and GEN II Pilot Line toolsets summarized in Table 1 with  their associated fab processes, are fully consistent to enable straightforward scale-up. A comprehensive characterization and metrology toolset listed in Table 2 has been acquired to provide QA/QC, failure analysis and process improvement tools.

1. Substrate / Planarization Material Systems: Si, Glass, PEN, Stainless Steel (SS)
2. Temporary Bonding Adhesives: 180 ºC, 350 ºC
3. Photolithography:  GEN II Scale Automated Distortion Compensation for Plastic Substrate Materials (PEN)
4. Deposition:

• Physical (sputter) Vapor Deposition (PVD): Al, Mo, ITO 
• Plasma-Enhanced Chemical Vapor Deposition (PECVD): a-Si, n⁺a-Si, SiN, SiO2, SiON 

5. Etch: Dry and Wet
6. Solution Processing: Spin-on Glass (SOG), PI, Benzocyclobutene (BCB); (6-in. line only)

Table 1:Pilot Line Toolset

Table 2: In-Fab Metrology Tools